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AI headlines love GPUs. But before a model trains, someone has to build the fabs, pattern the wafers, and package the silicon.

That’s where this name lives. The latest print was solid, the outlook a shade better than feared, and the 2026 map says slower China, stronger second half.

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Strategic Positioning

Applied Materials Inc. (NASDAQ: AMAT) sells the gear that turns sand and chemistry into chips: deposition, etch, implant, inspection, metrology, and the service muscle to keep it all humming.

It’s the broadest toolbox in wafer fab equipment (WFE), with a strong franchise in films and increasingly vital roles in advanced packaging as chips stitch together into HBM stacks and chiplets.

Why this still matters now:

  • AI Pull-Through, Not Just Hype. Training and inference need leading-edge logic, mountains of HBM DRAM, and better packaging. All three touch AMAT’s core.

  • Services Cushion. Applied Global Services smooths cycles and extends tool life; as nodes get trickier, service intensity rises.

  • Packaging Is The New Front Door. Performance gains are shifting from just smaller transistors to smarter stacking; AMAT is building here for years, not quarters.

Recent Momentum

AMAT beat on fiscal Q4: about $2.17 adjusted EPS on $6.8B revenue, modestly ahead of expectations.

The guide for the current quarter called for $6.85B ± $0.5B and $2.18 ± $0.20 EPS, slightly above consensus, though still down year over year on both lines.

Shares faded after hours because the mix shows near-term deceleration and the China path gets narrower.

Management also flagged:

  • China 2026 Headwind. Export controls shrink access to certain memory and legacy markets, taking China’s revenue mix from ~40% at the peak back toward the mid-20s.

  • Rule Relief, Not A Free Pass. A suspended affiliate rule unlocks roughly $600M in FY revenue and allows ~$110M of delayed Q4 shipments to go in the Nov–Jan window.

  • Cycle Timing. Customers signal WFE acceleration in 2H-2026, lining up with AI capacity adds and memory recovery.

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The Setup You’re Actually Betting On

  • HBM + Packaging Flywheel. AI memory ships with high bandwidth and stacked layers. That’s more deposition steps, tighter process control, and richer packaging—Applied’s wheelhouse.

  • Foundry/Logic Inflections. Gate-all-around, backside power, and denser interconnects mean new process steps and new tools. When the node shifts, capex follows.

  • Services As Shock Absorber. Installed base growth monetized through upgrades and parts helps margins and keeps earnings less twitchy than a pure new-tool cycle.

  • China Share Reset. Even with limits, the secular pie grows outside restricted lanes. Non-U.S. rivals can sell where AMAT can’t; the offset must come from memory recovery, packaging, and leading-edge logic elsewhere.

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Action Plan

Treat AMAT like a secular compounder navigating a choppy sea.

  • Starter Buy: Begin a position on pullbacks toward the low-210s or softer macro days.

  • Add On Proof: Add if the next quarter shows stable margins with bookings skewing to packaging, HBM, and leading-edge logic, and if China offsets are visible in backlog.

  • Sizing: 2–3% of equities is sensible for retail portfolios; it’s cyclical enough to move, diversified enough to sleep.

  • Time Horizon: Think in 6–12 month steps to the expected 2H-2026 WFE ramp, not six weeks.

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Valuation Check

At roughly ~27× trailing earnings with a ~0.8% dividend, you’re paying a quality multiple for a company tied to multiple secular lanes.

It’s not a bargain-bin sticker, but the combo of breadth, services, and packaging leverage supports a premium versus narrower peers.

If the multiple bothers you, scale in and let earnings catch up rather than waiting for the mythical “perfect” print.

Catalysts To Watch

  • HBM Capacity Adds. Any uptick in DRAM capex plans tied to AI clusters is a green light for films, etch, and packaging demand.

  • Packaging Wins. More disclosures on hybrid bonding, advanced substrates, and panel-scale momentum.

  • Foundry Node Updates. Gate-all-around and backside power timelines that pull tools forward.

  • Policy Stability. Clarity on export rules reduces the haircut investors apply to China exposure.

  • Services Growth. High single-digit to low-double-digit AGS growth would keep the gross margin bridge sturdy.

Risks

  • Policy Risk, Again. New or re-tightened curbs could chop estimates and shift share to non-U.S. OEMs.

  • Cycle Air Pockets. If hyperscalers pause orders or memory takes longer to heal, WFE drifts before 2H-2026.

  • Competitive Pressure. ASML monopolizes EUV; other peers nibble at steps with sharper pricing. Win rates matter.

  • Lumpy Recognition. Affiliate-rule timing and licensing can shuffle revenue between quarters and spook traders.

  • Capex Crowding-Out. Power constraints and data-center delays could push AI fab timing to the right.

How To Trade It Without Overthinking

  • Buy The Red, Not The Headline. Post-print dips on guidance haircuts are your friend if the secular story is intact.

  • Use Alerts. Set price alerts a few bucks below after-hours knee-jerks; AMAT often gives second chances.

  • Pairings. Balance AI chip exposure (higher beta) with AMAT (broader stack) to dampen single-name risk.

  • Trim Into Rips. If a target hike sends it sprinting back toward the mid-230s without new fundamentals, shave and reset.

What A Win Looks Like

  • Clean Guide Keeps Marching. Q1 lands near the top of $6.85B and $2.18 EPS ranges, with constructive commentary on backlog quality.

  • Packaging Mix Up. Tangible growth in advanced packaging tools and service pull-through.

  • Memory Turns Up. HBM orders show up in bookings, not just conference slides.

  • China Managed, Not Dominant. Mix holds in the mid-20s with licensed shipments and non-China growth offsetting bans.

  • R&D To Revenue. Clear milestones on gate-all-around, backside power, and energy-efficient process wins that anchor the FY27–28 pipeline.

Final Take

You don’t need to pick the next GPU winner to participate in AI.

You can own the process technology that everyone needs to build the silicon and stitch it together.

Applied just posted a respectable beat, guided a bit better than feared, and mapped a path where 2H-2026 looks busier than 1H. 

China is a real headwind, but not the whole story.

Buy it like a pro: scale in on weak tape, ask for execution around packaging and memory, and let the next leg of the WFE cycle do the heavy lifting.

That’s all for today. Thank you for reading. If you have any feedback, please reply to this email.

Best Regards,

— Adam Garcia
Elite Trade Club

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